9 boards in, I’m feeling good about the reflow oven. These are still hand placed parts and hand solder pasted, so next up is to stencil one of my boards. This board has a TSSOP with 0.65 mm pitch pins, so next up I’ll do a QFP with 0.6mm pins, then try a 100 QFP 0.5mm one. ( The STM32Hs are 0.5mm). Assuming all that works well and I’ll build up some multi processor boards and get working on the software with my friend Christopher Neil Bradley.

Thanks Clay Cowgill and everyone else for the tips on the solder paste. Just a tad less worked perfectly.